RD10 system power-path architecture from a bounded 5 to 20 volt source through BQ25798 to the NVDC system load and separately protected 2S lithium-ion pack at an 8.4 volt target.
RD10-V01 · Architecture explanation only. The source, system and pack paths do not represent a measured waveform or validated product.

01

Validation status and limitations

This English-only page is a calculated publication candidate, not a released schematic, validated charger or qualified product. No Hengshun hardware, waveform, efficiency map, thermal map, EMI result, battery-safety result or compliance report exists. TI EVM evidence is vendor context and is not transferable to a future Hengshun board.

Evidence boundary

  • Board and bench validation: NOT EXECUTED
  • Thermal characterization: NOT EXECUTED
  • EMI and compliance testing: NOT EXECUTED
  • Measured efficiency and transient response: NOT COLLECTED
  • Battery pack safety qualification: OUTSIDE THIS DESIGN
  • Production readiness: NO

02

Design intent and system boundary

RD10 defines a BQ25798 charging and power-path starting point for portable or industrial battery-powered equipment. A bounded source feeds the charger, the NVDC SYS rail powers the system load, and a separately protected 2S pack charges or supplements the system. Source negotiation, cell protection, fuel gauging and end-product safety are outside this stage.

Domain
Portable and industrial battery-powered equipment
Application
2S charging and NVDC system power
Design state
CALCULATED_DESIGN
Isolation
None · non-isolated

03

Official vendor context and device identity

Texas Instruments identifies BQ25798 as an I2C-controlled buck-boost charger with an NVDC power path for one-to-four-cell batteries. The selected orderable is BQ25798RQMR. The 1.5 MHz switching context, EVM application networks and SPM6530T-1R0M120 inductor originate in official TI materials; none is a Hengshun measurement.

04

NVDC power-path behavior

The adapter path feeds PMID and the four-switch converter, which regulates the SYS rail relative to the battery. The system can operate while the pack charges, charge current can reduce when source power is limited, and the battery can supplement the system when demand exceeds the allowed input. Exact priorities, thresholds and transitions remain configuration and bench work.

05

Four-switch buck-boost stage

Two switching half-bridges surround the selected 1 µH inductor so the converter can boost below the battery/system region, transition near it and buck above it. PMID, SYS and BAT capacitor banks are provisional. The visual is a functional redraw, not a pin-complete or construction-ready schematic.

06

Fourteen reproducible calculation screens

Every result below is Hengshun calculated design guidance. The equations are first-pass analytical screens, not simulated or measured performance, and the declared assumptions and exclusions remain binding.

RD10 Stage A calculation bundle — 14 calculation-only results
IDInputs / equationResultStatus and limitation
C018.4 V × 3 A25.2 WCalculated battery charge power; system load and loss excluded
C028.4 V / 20 V0.42 ratioIdeal high-line buck duty
C031 − 5 V / 8.4 V0.404762 ratioIdeal low-line boost duty
C048.4 V × (1−0.42) / (1 µH × 1.5 MHz)3.248 A p-pIdeal high-line ripple screen
C055 V × 0.404762 / (1 µH × 1.5 MHz)1.349206 A p-pIdeal low-line ripple screen
C065 V × 3 A × 0.90 / 8.4 V1.607143 ALow-line source-limited charge; zero system load assumed
C078.4 V × 3 A / (5 V × 0.90)5.6 AInput required for 3 A charge at 5 V; exceeds 3 A source
C088.4 V × 3 A / (20 V × 0.90)1.4 AInput required for 3 A charge at 20 V
C093 A + 1.349206 A / 23.674603 AIdeal low-line peak screen
C103 A + 3.248 A / 24.624 AIdeal high-line peak screen
C1111.1 A / 4.624 A2.400952 ratioEVM inductor rating ratio; temperature and tolerance open
C120.1 µF + 3 × 10 µF30.1 µF nominalPMID arithmetic sum; derating excluded
C130.1 µF + 5 × 10 µF50.1 µF nominalSYS arithmetic sum; transient adequacy open
C140.1 µF + 2 × 10 µF20.1 µF nominalBAT arithmetic sum; pack impedance open

07

Low-line source-limited behavior

At 5 V and a 3 A source limit, an explicit 90% planning assumption gives approximately 1.607143 A battery current before system load. Reaching 3 A battery charge at the same input would require about 5.6 A. Firmware and hardware limits must therefore prioritize source safety and system load instead of promising 3 A charge across the full range.

08

Magnetics, capacitors and unresolved margins

The selected EVM-documented 1 µH inductor provides a reproducible starting point, while current ripple, peak current and the 11.1 A rating ratio remain calculation screens. All three capacitor banks require effective-capacitance, ESR, ESL, bias, temperature, ripple and transient review on the target layout.

09

Critical BOM maturity

The Stage A split is preserved exactly: two selected rows, ten provisional rows and four deferred rows. A selected row supports this calculation starting point; it does not make the assembly procurement-ready or production-ready.

RD10 critical BOM — 16 rows: 2 selected, 10 provisional, 4 deferred
IDFunctionPart or starting valueStatusOpen evidence
B01Buck-boost charger and NVDC pathBQ25798RQMRSELECTEDTarget-board thermal and functional validation
B02Power inductorTDK SPM6530T-1R0M120 · 1 µH · 11.1 A EVM ratingSELECTEDTolerance, temperature, saturation and layout
B03PMID capacitor network0.1 µF + 3 × 10 µFPROVISIONALDielectric, bias, ripple and placement
B04SYS capacitor network0.1 µF + 5 × 10 µFPROVISIONALEffective capacitance and transient response
B05BAT capacitor network0.1 µF + 2 × 10 µFPROVISIONALPack lead and hot-plug behavior
B06REGN decoupling4.7 µF starting valuePROVISIONALRating, package and placement
B07Bootstrap capacitors47 nF × 2PROVISIONALRating, dielectric and layout
B08ILIM_HIZ hardware limitNetwork value TBDPROVISIONALEquation and tolerance stack
B09Battery temperature sensingPack-qualified NTC networkPROVISIONALNTC curve, JEITA profile and thresholds
B10I2C / interrupt interfaceHost-compatible pull-up networkPROVISIONALHost rail, capacitance and fault policy
B11Hot-plug damping / protectionOptional snubber or TVSPROVISIONALSource impedance, surge target and energy
B12Input adapter FETSingle-source adapter-path implementationPROVISIONALSOA, RDS(on), reverse behavior and thermal rise
B132S pack protection and fusePack-qualified systemDEFERREDCell limits, safety and fuse coordination
B14Input connector and cableRated source interconnectDEFERREDHeating, cycles and source contract
B15Ship / system-load disconnectOptional external switchDEFERREDState machine, leakage and safety
B16PCB thermal path and enclosureStack-up, copper, vias and airflow TBDDEFERREDThermal model and enclosure testing

10

Planned bench validation

The evidence plan contains fifteen future items and zero executed items. The list records what must be measured later and does not contain a pass result.

  • PLANNED_NOT_EXECUTED — BP-01 Pre-power inspection of the as-built schematic, BOM, polarity, resistance and continuity before energization.
  • PLANNED_NOT_EXECUTED — BP-02 Current-limited bring-up at 5 V, 9 V, 12 V, 15 V and 20 V with a battery simulator and conservative source limits.
  • PLANNED_NOT_EXECUTED — BP-03 Input and charge-current sweep with the programmed input limit up to 3 A and the charge command bounded by available power.
  • PLANNED_NOT_EXECUTED — BP-04 CC/CV charge profile across representative 2S pack states below, near and at the 8.4 V target.
  • PLANNED_NOT_EXECUTED — BP-05 NVDC system-load sweep with and without simultaneous battery charging.
  • PLANNED_NOT_EXECUTED — BP-06 Battery supplement-mode exercise when system demand exceeds the allowed input power.
  • PLANNED_NOT_EXECUTED — BP-07 Controlled adapter insertion and removal with VBUS, PMID, VSYS and VBAT waveform capture.
  • PLANNED_NOT_EXECUTED — BP-08 Low-line power-limit behavior at 5 V and a 3 A input-current limit without assuming 3 A battery charge.
  • PLANNED_NOT_EXECUTED — BP-09 Inductor-current and switch-node observation in boost, transition and buck operating regions.
  • PLANNED_NOT_EXECUTED — BP-10 Ripple and noise measurement with declared bandwidth and low-inductance probing.
  • PLANNED_NOT_EXECUTED — BP-11 Thermal characterization at selected worst-case source, charge and system-load points.
  • PLANNED_NOT_EXECUTED — BP-12 Fault and recovery checks for bounded input, battery, load, NTC and short-circuit conditions.
  • PLANNED_NOT_EXECUTED — BP-13 I2C, interrupt and watchdog behavior with a reproducible register image and safe-state review.
  • PLANNED_NOT_EXECUTED — BP-14 Efficiency and loss mapping across the approved 5/9/12/15/20 V matrix with measurement uncertainty.
  • PLANNED_NOT_EXECUTED — BP-15 Exploratory conducted and radiated EMI pre-scan with no compliance claim.

11

Visual evidence boundary

Six original code-native SVGs explain architecture, the four-switch stage, calculated operating regions, component screens, placement priorities and evidence maturity. They contain no stock imagery, fabricated waveforms, thermographs, measured curves or compliance evidence.

  • RD10-V01 — System power path · architecture only; no measured waveform
  • RD10-V02 — Four-switch charging stage · not a production schematic
  • RD10-V03 — Operating regions and power budget · calculated guidance
  • RD10-V04 — Inductor and capacitor screens · derating remains open
  • RD10-V05 — Hot-loop placement priorities · not a PCB or EMI result
  • RD10-V06 — BOM and validation maturity · not production readiness

12

Relationship implementation plan

Five reviewed conversion or navigation paths are available. Two missing content types remain explicit non-links, two future topics remain discovery-only, and localized editions remain deferred.

RD10 relationship review — 5 resolved, 2 explicit no-link, 2 discovery-only, 1 deferred
IDTargetPublic actionStatus
R01Battery Charging & Power PathPrimary solution relationshipRESOLVED_LINK
R02DC-DC Power ConversionSecondary solution relationshipRESOLVED_LINK
R03BMS PowerApplication relationshipRESOLVED_LINK
R04BMS Auxiliary Power Reference DesignRelated design cardRESOLVED_LINK
R05Request a DesignExisting engineering CTARESOLVED_LINK
R06BQ25798 Component GuidePlain text only; page does not existEXPLICIT_NO_LINK
R07Battery charger selection guideNo card until separately publishedEXPLICIT_NO_LINK
R08USB Type-C / USB-PD source integrationEditorial discovery onlyDISCOVERY_ONLY
R092S protector, gauge and monitorFuture subsystem discovery onlyDISCOVERY_ONLY
R10Localized RD10 editionsNo placeholder translationsDEFERRED

13

Official sources

First-party Texas Instruments sources support device identity, application behavior, orderable identity, EVM networks and vendor reference context. The TIDA source provides adjacent reference context only. Vendor material does not establish Hengshun board performance.

14

Related public engineering context

The reviewed links connect RD10 to Battery Charging & Power Path, DC-DC Power Conversion, BMS Power and the BMS auxiliary supply design. Project-specific pack, source and system-load requirements can proceed through Request a Design. Missing component-guide and technical-guide pages are intentionally not fabricated.

RD10 simplified four-switch synchronous buck-boost charging stage showing the input FET, VBUS and PMID network, Q1 through Q4, selected 1 microhenry inductor and provisional SYS and BAT networks.
RD10-V02 · Functional technical redraw only. It is not a pin-complete production schematic or released PCB design.
RD10 calculated operating-region map comparing 5 volt boost, the 8.4 volt transition region and 20 volt buck operation, including source-limited current and the unavailable 3 ampere low-line charge target.
RD10-V03 · Calculated guidance only. The 90 percent efficiency term is a planning assumption, not a measurement or vendor guarantee.
RD10 inductor-current and capacitor screen showing calculated high-line and low-line ripple, peak-current results, the selected 11.1 ampere inductor rating and three provisional nominal capacitor sums.
RD10-V04 · First-pass calculation screen. Inductor temperature and capacitor bias, tolerance, ESR, ESL and transient adequacy remain open.
RD10 conceptual placement-priority map showing compact PMID and SYS hot loops, small switch-node areas, the nearby one microhenry inductor and separation of TS and I2C quiet signals.
RD10-V05 · Layout-priority guidance only. This is not a manufacturable PCB layout and contains no thermal or EMI evidence.
RD10 evidence-maturity matrix showing sixteen BOM rows split into two selected, ten provisional and four deferred, alongside fifteen planned bench items with zero executed.
RD10-V06 · Maturity and planning status only. The design is not procurement-ready or production-ready, and no bench item has been executed.